COPPER ALLOY JOINED BODY

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250114858A1
SERIAL NO

18981790

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

There is provided a copper alloy bonded body composed of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another, wherein a bonding interface between the members remains. In the bonded body, the content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and, in a laser microscope image of a section including the bonding interface, a ratio of a total length of a line segment corresponding to a discontinuous region relative to an entire length of a bonding interface line defined along the bonding interface and a position where the bonding interface was present is 3.5% or more. The discontinuous region is defined as a region where, when a plurality of perpendicular lines is drawn with respect to the bonding interface line at a pitch of 5 μm, three or more adjacent perpendicular lines do not intersect with the remaining bonding interface.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
NGK INSULATORS LTD2-56 SUDA-CHO MIZUHO-KU NAGOYA-SHI AICHI-PREFECTURE 467-8530

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AKAIWA, Masaaki Chita-Gun, JP 5 3
ISHIKAWA, Takahiro Toyoake-Shi, JP 91 569
NOMURA, Kazuhiro Handa-Shi, JP 33 368

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation