COPPER ALLOY BONDED BODY
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United States of America
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Apr 10, 2025
app pub date -
Dec 16, 2024
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Dec 16, 2024
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Abstract
There is provided a copper alloy bonded body composed of members made of an age-hardenable copper alloy, diffusion-bonded to one another. In the bonded body, a bonding interface between the members remains, and (i) the age-hardenable copper alloy is a beryllium copper alloy of which the beryllium content is 0.7% by weight or less, and an area ratio of inclusions composed of an oxide, a carbide, and/or an intermetallic compound in a HAADF-STEM image of a rectangular section of a size of 800 nm×400 nm including the bonding interface is 7.5% or less, or (ii) the age-hardenable copper alloy is a copper alloy free from beryllium, and an area ratio of inclusions composed of an oxide, a carbide, and/or an intermetallic compound in a HAADF-STEM image of a rectangular section of a size of 800 nm×400 nm including the bonding interface is 30% or less.
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