ULTRASOUND PROBE, METHOD OF MANUFACTURING the same, AND STRUCTURE COMBINABLE WITH MAIN BACKING LAYER OF THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250114071A1
SERIAL NO

18403004

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Abstract

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Disclosed is an ultrasound probe including a main backing layer, a piezoelectric layer provided to extend in a horizontal direction on an upper side of the main backing layer to be electrically connected to a first electrode and a second electrode, an acoustic matching layer provided to extend in the horizontal direction on an upper side of the piezoelectric layer, a sub-backing layer provided to extend in a vertical direction below a lower side of the acoustic matching layer, and a flexible printed circuit board including a signal electrode in contact with the first electrode and a ground electrode.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG MEDISON CO LTD3366 HANSEO-RO NAM-MYEON HONGCHEON-GUN GANGWON-DO 25108

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kwon, Sungdo Seoul, KR 1 0
Kyung, Yoonsung Uiwang-si, Gyeonggi-do, KR 3 0
Shim, Dongwoo Suwon-si, Gyeonggi-do, KR 1 0

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