QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Dec 7, 2023
filing date -
Dec 7, 2023
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Abstract
Conductive features of a device including quantum dots of a first substrate are bonded to conductive features of a second substrate. A quantum dot layer is formed on the first substrate having conductive features in a dielectric layer. Hybrid bonding of the first substrate to the second substrate is performed without use of an intervening adhesive to connect the first conductive features and the second conductive features.
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