Wiring Substrate, Backplane and Electronic Apparatus
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Apr 3, 2025
app pub date -
May 18, 2023
filing date -
May 18, 2023
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A wiring substrate includes a substrate and connection wires. At least one connection wire including a first connection end and another at least one connection wire including a second connection end, together define at least one bonding pad group. A bonding pad group is located in a region where a pair of first and second connection ends proximate to each other are located, and includes: at least one first sub-bonding pad, which is a portion of the first connection end, and at least two second sub-bonding pads, which are a portion of the second connection end. In the at least one first sub-bonding pad and the at least two second sub-bonding pads, a first sub-bonding pad is arranged adjacent to a second sub-bonding pad along a first direction, and arranged adjacent to another second sub-bonding pad along a second direction intersecting the first direction.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully