STACKED QUANTUM DOT SENSORS AND METHODS OF FORMING THE SAME
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 25, 2024
filing date -
Sep 25, 2024
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Abstract
A method of forming a stacked image sensor comprises providing a first substrate and a second substrate. The first substrate comprises a first matrix comprising first quantum dots, a first dielectric layer adjacent to the first matrix, and first bond pads disposed in the first dielectric layer. The second substrate comprises a second matrix comprising second quantum dots, a second dielectric layer adjacent to the second matrix, and second bond pads disposed in the second dielectric layer. The method includes hybrid bonding the first substrate to the second substrate without use of an intervening adhesive to form the stacked image sensor, where the hybrid bonding connects the first bond pads to the second bond pads.
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