HIGH EFFICIENCY QUANTUM DOT IMAGE SENSORS AND METHODS OF FORMING THE SAME
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Dec 18, 2023
filing date -
Dec 18, 2023
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Abstract
An image sensor using quantum dots is formed that improves collection of photogenerated carrier using a conductive matrix, a semiconductive matrix, a matrix comprising conductive particles and quantum dots in a transparent non-conductive material, conductive structures, and/or porous conductive structures. Hybrid bonding of the image sensor to an image processor device is performed without use of an intervening adhesive to connect the image sensor to the image processor device.
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