TRENCH CONTACT STRUCTURE WITH ETCH-STOP LAYER

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250113559A1
SERIAL NO

18374600

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Abstract

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Trench contact structures with etch stop layers, and methods of fabricating trench contact structures with etch-stop layers, are described. In an example, an integrated circuit structure includes a fin structure. An epitaxial source or drain structure is on the fin structure. An isolation structure is laterally adjacent to sides of the fin structure. A dielectric layer is on at least a portion of a top surface of the isolation structure and partially surrounds the epitaxial source or drain structure and leaves an exposed portion of the epitaxial source or drain structure. A conductive trench contact structure is on the exposed portion of the epitaxial source or drain structure. The conductive trench contact structure does not extend into the isolation structure.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BLVD SANTA CLARA CA 95052

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHAO, Robin Portland, US 24 6
CHU, Tao Portland, US 48 25
GOLONZKA, Oleg Beaverton, US 104 575
HUANG, Chiao-Ti Portland, US 29 4
HUNG, Ting-Hsiang Beaverton, US 19 4
LIN, Chia-Ching Portland, US 227 960
LIN, Chung-Hsun Portland, US 181 2526
MURTHY, Anand S Portland, US 351 6235
XU, Guowei Portland, US 69 186
ZHANG, Feng Hillsboro, US 1002 28040
ZHANG, Yang Rio Rancho, US 898 4769

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