FOLDABLE THERMAL GROUND PLANES FOR ELECTRONIC DEVICES
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Apr 3, 2025
app pub date -
Dec 12, 2024
filing date -
Dec 12, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Systems, apparatus, articles of manufacture, and methods are disclosed for foldable thermal ground planes for electronic devices. An example an apparatus to cool an electronic device includes a first plate; a second plate; a plurality of first pillars extending between the first plate and the second plate, the plurality of first pillars having a first shape; a plurality of second pillars extending between the first plate and the second plate, the plurality of second pillars having a second shape, the second shape different than the first shape; and a hinge separating the apparatus into a first section and a second section, the plurality of second pillars in the hinge.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully