CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SPLIT SUBSTRATE

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United States of America

APP PUB NO 20250113439A1
SERIAL NO

18957959

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Abstract

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In a ceramic substrate according to an embodiment, there are two or more peaks within a range of 98 eV or higher and 106 eV or lower in a spectrum obtained by measuring a laser-irradiated zone on a laser-processed surface by X-ray Photoelectron Spectroscopy (XPS). A ceramic circuit board and a semiconductor device including the ceramic substrate are provided. Methods for manufacturing the ceramic substrate and a ceramic split substrate are also provided.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBA1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 105-0023
TOSHIBA MATERIALS CO LTD8 SHINSUGITA-CHO ISOGO-KU YOKOHAMA-SHI KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MATSUMOTO, Yukihisa Yokohama, JP 4 0

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