Elastic Wave Device and Module Using Elastic Wave Device

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250112615A1
SERIAL NO

18900921

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Abstract

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The present application relates to an elastic wave device and a module using the elastic wave device. The elastic wave device comprises a supporting substrate; a dielectric layer formed on the supporting substrate; an insulating layer formed on the dielectric layer; a piezoelectric layer formed on the insulating layer; and a resonator including IDT electrodes formed on the piezoelectric layer. The dielectric layer includes a first strip-shaped acoustic impedance region with a long side direction and a short side direction; and a second strip-shaped acoustic impedance region arranged alternately with the first acoustic impedance region and having a different acoustic impedance from that of the first acoustic impedance region. The elastic wave device of this application provides good temperature characteristics and effectively suppresses spurious response.

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Patent Owner(s)

Patent OwnerAddress
SANAN JAPAN TECHNOLOGY CORPORATION2-5-4 FUKUZUMI KOTO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAKAMURA, Hiroshi Tokyo, JP 877 11765
SHIOI, Shinichi Tokyo, JP 17 0
SHUN, Subei Tokyo, JP 11 18

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