MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR LASER ELEMENT, LASER ELEMENT, AND ELECTRONIC DEVICE
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Jan 25, 2023
filing date -
Jan 25, 2023
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Abstract
A manufacturing method for a laser element includes preparing a semiconductor substrate including a base substrate, a first growth suppressive part and a second growth suppressive part adjacent to each other with an opening portion interposed therebetween, and a first semiconductor part having a longitudinal shape and positioned on the first growth suppressive part and the second growth suppressive part from the opening portion, forming, on the first semiconductor part, a second semiconductor part including a ridge portion positioned above the first growth suppressive part, and scribing a portion, of a first laminate body including the first semiconductor part and the second semiconductor part, positioned on a side where the ridge portion is positioned.
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