BANDWIDTH IMPROVEMENT OF THROUGH-HOLE DISTRIBUTED FEEDBACK LASER
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 29, 2023
filing date -
Sep 29, 2023
priority date (Note) -
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Abstract
A laser emitting device includes a casing and first, second and third through-hole leads protruding through the casing. A proximal end portion of each of the first through third through-hole leads is located within the casing, and a distal end portion of each of the first through third through-hole leads is located external the casing. The laser emitting device further includes a laser diode and a photodiode located within the casing. The laser diode includes a cathode electrically connected to the proximal end portion of the first through-hole lead and an anode electrically connected to the proximal end portion of the second through-hole lead, and the photodiode includes a cathode electrically connected to the anode of the laser diode and an anode electrically connected to the proximal end portion of the third through-hole lead. The laser emitting device still further includes a resistor mounted to an outside of the casing, and electrically connected between the casing and the distal end of the third through-hole lead.
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