SEMICONDUCTOR PACKAGE WITH RFIC AND ANTENNA
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Aug 28, 2024
filing date -
Aug 28, 2024
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Abstract
The present disclosure relates to a semiconductor package comprising a substrate, a radio frequency integrated circuit attached to the substrate, optionally at least one semiconductor die attached to the substrate and coupled to a radio frequency integrated circuit (RFIC) via one or more signal lines, a molding compound encapsulating the RFIC and the optional semiconductor die, and an antenna formed on the molding compound and coupled to the RFIC.
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