PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Dec 13, 2024
filing date -
Dec 13, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
Provided are a package structure and a method of forming the same. The package structure includes a first tier, a second tier, and a third tier. The first tier includes an interposer. The second tier is disposed on the first tier and includes a bottom die. The third tier is disposed on the second tier and includes a plurality of first dies and at least one second die. The at least one second die is disposed between the plurality of first dies. The plurality of first dies are electrically connected to the bottom die by a plurality of first connectors to form a signal path, the plurality of first dies are electrically connected to the interposer by a plurality of second connectors to form a power path, and the plurality of first connectors are closer to the at least one second die than the plurality of second connectors.
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