DUAL-SIDE BRIDGE CHIPS CONNECTING TWO SEMICONDUCTOR CHIPS WITH STACKED SEMICONDUCTOR DEVICES
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 28, 2023
filing date -
Sep 28, 2023
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Abstract
A semiconductor structure includes at least two chiplets, where each chiplet includes a top semiconductor device with frontside interconnect wiring contacting a substrate with through-silicon vias and the top semiconductor device contacts a bottom semiconductor device with backside interconnect wiring. At least a first bridge chip connects to a first portion of the backside interconnect wiring in each of the two chiplets and at least a second bridge chip connects the frontside interconnect wiring in each of the two chiplets to the substrate with the through-silicon vias in each of the two chiplets. The top semiconductor device and the bottom semiconductor device in each of the two chiplets are electrically connected.
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