Die and Wafer Level Processing of Laser Diodes and Other Semiconductor Devices on Non-Native Semiconductor Wafers
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Apr 3, 2025
app pub date -
May 23, 2024
filing date -
May 23, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An electronic device includes a set of semiconductor layers defining a set of semiconductor mesas. A first dielectric abuts the set of semiconductor layers at a perimeter of the set of semiconductor layers. A second dielectric is disposed on the set of semiconductor mesas. A set of conductors is routed in or on the second dielectric. The set of conductors is electrically connected to at least one active device defined in at least one semiconductor mesa of the set of semiconductor mesas. The set of conductors is configured to route electrical signals to or from the at least one semiconductor mesa, and the set of conductors includes a set of hybrid bonding pads on the second dielectric.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully