BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 28, 2023
filing date -
Sep 28, 2023
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Abstract
Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. An integrated circuit (IC) die and a surface of a substrate each include hybrid bonding regions surrounded by hydrophobic structures. The hydrophobic structures include non-vertical inward sloping sidewalls or similar features to contain a liquid droplet that is applied to the die or substrate hybrid bonding region. After the hybrid bonding regions are brought together, capillary forces cause the die to self-align, and a hybrid bond is formed by evaporating the liquid and subsequent anneal. IC structures including the IC die and portions of the substrate are segmented and assembled.
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