ANNEALED SHAPE MEMORY ALLOY ON A SUBSTRATE
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 28, 2023
filing date -
Sep 28, 2023
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Abstract
Embodiments herein relate to systems, apparatuses, techniques or processes for forming an annealed shape metal alloy (SMA) on a wafer or a die complex. In embodiments, the annealed SMA, when heated above a transition temperature, may enter an Austenite phase and return to the shape that the wafer or die complex had when it was annealed. In embodiments, this may maintain a shape of a wafer or a die complex during higher temperature processing, for example during reflow, when the package undergoes fabrication. Other embodiments may be described and/or claimed.
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