PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 28, 2023
filing date -
Sep 28, 2023
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Abstract
A surface of an integrated circuit (IC) die structure and a substrate to which the IC die structure is to be bonded include biphilic regions suitable for liquid droplet formation and droplet-based fine alignment of the IC die structure to the substrate. To ensure warpage of the IC die structure does not interfere with droplet-based fine alignment process, an IC die structure of greater thickness is aligned to the substrate and thickness of the IC die structure subsequently reduced. In some embodiments, a back side of the IC die structure is polished back post attachment. In some alternative embodiments, the IC die structure includes sacrificial die-level carrier is removed after fine alignment and/or bonding.
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