CONTROLLING SUBSTRATE BUMP HEIGHT
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 29, 2023
filing date -
Sep 29, 2023
priority date (Note) -
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Abstract
A device comprises a substrate comprising a plurality of build-up layers and a cavity. A bridge die is located within the cavity and a plurality of cavity side bumps are on one side of the bridge die. A plurality of interconnect pads with variable heights are on one of the build-up layers of the substrate coupled to the plurality of the cavity side bumps to bond the bridge die to the substrate.
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