GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
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United States of America
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Apr 3, 2025
app pub date -
Sep 29, 2023
filing date -
Sep 29, 2023
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Abstract
Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.
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