THROUGH SUBSTRATE VIA STRUCTURES AND PROCESSES
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Nov 21, 2023
filing date -
Nov 21, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a microelectronic structure including a first element and a through substrate via (TSV) structure. The first element includes a bulk portion having a front side and a back side opposite the front side. The TSV structure is disposed in an opening extending at least partially through the bulk portion from the front side to the back side. The TSV structure includes a conductive tip portion and a second conductive via portion. The second conductive via portion is disposed between the front side and the conductive tip portion. The conductive tip portion contains a different conductive material than the second conductive via portion.
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