Semiconductor Package and Method for Manufacturing Semiconductor Package
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Dec 13, 2024
filing date -
Dec 13, 2024
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Abstract
A semiconductor package comprises: a thermally conductive layer and semiconductor devices thermally connected with the thermally conductive layer. The semiconductor devices produce heat, which the thermally conductive layer dissipates at least partly. Some heat is transferred from a semiconductor device to another semiconductor device. The semiconductor package further comprises a temperature balancing element arranged in thermal connection i) with the thermally conductive layer and ii) with the other semiconductor device(s).
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