APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 29, 2023
filing date -
Sep 29, 2023
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Abstract
An apparatus is provided which comprises: a plurality of interconnect layers within a substrate, organic dielectric material over the plurality of interconnect layers, copper pads on a surface of a cavity within the organic dielectric material, an integrated circuit bridge device coupled with the copper pads, wherein a surface of the integrated circuit bridge device is elevated above an opening of the cavity, underfill material between the integrated circuit bridge device and the surface of the cavity, and build-up layers formed over the organic dielectric material around the integrated circuit bridge device. Other embodiments are also disclosed and claimed.
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