Robotic Cover Sealer

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250112060A1
SERIAL NO

18858306

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A scaling system is described using parameters. The system may obtain input data comprising one or more of a set of package parameters, a set of cover parameters, a set of seal ring parameters, or a set of power parameters. The system may, based at least on the set of cover parameters and the set of package parameters, accurately place the cover on top of the package. The system may use the vision data for programming of the seal operation. The system may apply a force to electrodes and apply a power pulse to the cover and the package to create a hermetic seal. The system may enables change from one package type to another with only one PC program change.

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Patent Owner(s)

Patent OwnerAddress
MICROCIRCUIT LABORATORIES LLCKENNETT SQUARE PA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Richardson, Rich Kennett Square, US 1 0

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