METHOD FOR FORMING A PATTERN ON A SUBSTRATE
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 27, 2024
filing date -
Sep 27, 2024
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Abstract
A method for forming a pattern on a substrate disclosed. The method comprising, providing an Extreme Ultraviolet (EUV) lithography system having an exposure chamber, providing a substrate to the exposure chamber, the substrate comprising a patternable layer, the patternable layer comprising a photosensitive surface termination; and exposing the substrate to EUV radiation while exposing the patternable layer to a reactive gas, thereby forming a pattern on the patternable layer, comprising exposed areas and unexposed areas, the unexposed areas comprising the photosensitive surface termination and the exposed areas comprising an altered surface termination.
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