PHOTONIC SEMICONDUCTOR-INSULATOR-SEMICONDUCTOR MODULATOR AND METHODS FOR FORMING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250110360A1
SERIAL NO

18478890

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An embodiment photonic device may include a first terminal including silicon and a second terminal including polysilicon. The first terminal may be configured as a first three-dimensional structure extending along a first direction and having a first U-shaped portion in a first cross-sectional plane perpendicular to the first direction. Similarly, the second terminal may be configured as a second three-dimensional structure extending along the first direction and having a second U-shaped portion in the first cross-sectional plane. The photonic device may further include a capacitor dielectric layer disposed between the first terminal and the second terminal and a cladding dielectric layer surrounding the first terminal and the second terminal. The first U-shaped portion and the second U-shaped portion may be arranged in an interlocking configuration having an overlapping region that is configured as an optical transmission line in which the first direction is an optical propagation direction.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDNO 8 LI-HSIN 6 ROAD HSINCHU SCIENCE PARK HSINCHU ROC 30077

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsia, Hsing-Kuo Jhubei City, TW 122 756
Lee, Ming Taipei City, TW 49 598
Lin, Wei-Heng Taipei City, TW 12 122
Shen, Tien-Lin Taipei City, TW 3 0
Yu, Chen-Hua Hsinchu City, TW 2207 47923

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