SEMICONDUCTOR PHOTONICS DEVICE AND METHODS OF FORMATION

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250110275A1
SERIAL NO

18403258

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Abstract

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A semiconductor photonics device includes a multiple-layer coupler structure. The multiple-layer coupler structure includes a plurality of optical coupler layers, which enables the properties of the optical coupler layers to be configured to achieve efficient optical coupling for a broad spectrum of optical wavelengths. This enables the multiple-layer coupler structure to handle wide bandwidth optical signals, which enables the semiconductor photonics device to support high-bandwidth optical communication applications. Moreover, the optical coupler layers of the multiple-layer coupler device enable the performance of the multiple-layer coupler structure to be increased using less complex and less costly semiconductor manufacturing processes and techniques. Additionally, the optical coupler layers of the multiple-layer coupler structure enable the multiple-layer coupler structure to handle bidirectional transmission of optical signals, thereby enabling transmission of optical signals between various layers of the semiconductor photonics device.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUANG, Tai-Chun New Taipei City, TW 170 1430
RUSU, Stefan Sunnyvale, US 192 1598

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