APPARATUS AND METHODS FOR THERMAL TESTING WITHIN ELECTRONIC COMPONENT ASSEMBLIES

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250110174A1
SERIAL NO

18479598

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Abstract

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Methods and apparatuses directed to detecting the degradation of electronic components based on thermal testing. In some examples, a device includes heat detection elements, a temperature controller, a memory, and a processor. The temperature controller can receive a signal from each of the heat detection elements and determine a corresponding operating temperature. The processor can receive the operating temperatures from the temperature controller, and can read from the memory a threshold temperature corresponding to each of the heat detection elements. Further, the processor can compare the operating temperatures to their corresponding threshold temperatures and, based on the comparison, generate thermal error data characterizing detected thermal discrepancies. The processor can transmit the thermal error data to cause further operations, such as the disabling of a safety feature, or the display of a warning message, for example.

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Patent Owner(s)

Patent OwnerAddress
QUALCOMM INCORPORATED5775 MOREHOUSE DRIVE SAN DIEGO CA 92121-1714

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AHUJA, Vipul Deepak Bengaluru, IN 1 0
GULATI, Rahul San Diego, US 54 221
JAIN, Palkesh Bangalore, IN 33 212
PALIWAL, Niraj Shantilal Nasik, IN 2 0
PATIL, Nikhil Rajendra Bengaluru, IN 1 0

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