METHODS, SYSTEMS, ARTICLES OF MANUFACTURE, AND APPARATUS FOR IMPROVED THERMAL TESTS OF INTEGRATED CIRCUIT DEVICES
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 28, 2023
filing date -
Sep 28, 2023
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Abstract
Systems, apparatus, articles of manufacture, and methods are disclosed that improve thermal tests of integrated circuit devices. An example apparatus includes interface circuitry; machine readable instructions; and programmable circuitry to at least one of instantiate or execute the machine readable instructions to determine a condition of a fluid to be dispensed by a pneumatic nozzle, the condition of the fluid including a temperature of the fluid; determine a ratio of a first liquid, a second liquid, and a superheated vapor that combine to result in the condition of the fluid; and cause the first liquid, the second liquid, and the superheated vapor to be provided to the pneumatic nozzle in proportions defined by the ratio.
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