PROBE CARD AND THERMAL CONDUCTION DEVICE THEREOF
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Dec 22, 2023
filing date -
Dec 22, 2023
priority date (Note) -
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Abstract
The present disclosure provides a probe card and a thermal conduction device thereof. The thermal conduction device includes a plurality of first walls and a plurality of second walls. The first walls and the second walls are crossly arranged to form a plurality of accommodation spaces. The probe assemblies are disposed in the accommodation spaces. Each probe assembly includes a plurality of probes and a case which is configured to accommodate the probes. First ends of the probes face toward an opening of the corresponding accommodation space. Second ends of the probes face toward another opening of the corresponding accommodation space.
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