Micro-Ring Resonator Strain Sensors for In-Situ Stress Monitoring
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Sep 29, 2023
filing date -
Sep 29, 2023
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Abstract
The present disclosure is directed to testing vehicles for optical devices and other semiconductor devices that have insitu sensor units for measuring localized strains, and methods for their use. In an aspect, the optical device may include a photonic integrated circuit device having several components including a laser, an optical amplifier, a waveguides, a modulator, a demodulator, and photodetectors. In another aspect, the sensor unit may include a micro-ring resonator strain sensor, an input grating coupler and an output grating coupler that are coupled to the micro-ring resonator strain sensor, for which the input grating coupler is coupled to a light source and the output grating coupler is coupled to an optical power meter. In yet another aspect, the sensor unit may include a temperature calibration unit having a heater and a temperature diode.
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