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Abstract

This disclosure relates to new multi-modal sensing array architectures that can sense normal and shear forces. Examples include resistive sensing arrays that are used to measure changes in the environment and manufacturing processes to produce multi-modal sensing arrays in a highly-automated and inexpensive fashion. Specifically, a manufacturing process includes a cutting operation and sewing/embroidery technique that creates a fully automated process to produce a resistive sensing array. The new manufacturing process enables the reduction of processing time and materials to produce a functioning sensor without limiting the designs space of achievable sensor geometries. Also presented are sensor reading methodologies for high-speed reading that are capable of sensing vibrations and a wide range of forces. Examples include the use of the new sensor arrays in wearable devices.

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First Claim