CLADS HAVING POLYMER FILMS AND METAL LAYERS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250109265A1
SERIAL NO

18897545

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Abstract

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In a first aspect, a clad includes a polymer film and a first metal layer adhered to the polymer film. The polymer film includes an electrically conductive filler and has a surface resistivity of 1 Megaohm/square or less. The first metal layer has a thickness of 100 μm or less. The clad has less than 15 ppm of Pd. The metal layer is formed on the polymer film by directly electrochemically depositing the first metal layer on the polymer film.

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Patent Owner(s)

Patent OwnerAddress
DUPONT ELECTRONICS INCWILMINGTON DE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
GONZALEZ, ROSA IRENE CIRCLEVILLE, US 6 28
MACLAUGHLIN, LAILA CIRCLEVILLE, US 5 0
MULZER, CATHERINE R CIRCLEVILLE, US 2 0
NAAB, BENJAMIN D MARLBOROUGH, US 2 12
NIAZIMBETOVA, ZUHRA I MARLBOROUGH, US 21 29
REINTHAL, MARY WILMINGTON, US 1 0
TAINTOR, PATRICIA MARLBOROUGH, US 1 0

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