COMPOSITION FOR FORMING RESIST UNDERLAYER FILM CONTAINING HYDROXYCINNAMIC ACID DERIVATIVE
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Oct 17, 2022
filing date -
Oct 17, 2022
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Abstract
A resist underlayer film exhibits excellent removability in a wet etching chemical liquid while mainly exhibiting excellent resistance to a resist solvent or a resist developer. A composition for forming a resist underlayer film for i-line contains a reaction product of a bifunctional or higher glycidyl ester type epoxy resin and a compound A represented by the following Formula (A), and a solvent.
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