NEGATIVE THERMAL EXPANSION MATERIAL, METHOD FOR PRODUCING THE SAME, AND COMPOSITE MATERIAL

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United States of America

APP PUB NO 20250109034A1
SERIAL NO

18840630

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Abstract

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An object of the present invention is to provide a negative thermal expansion material having better negative thermal expansion characteristics. The present invention is a negative thermal expansion material, comprising a copper vanadium composite oxide dissolving Li atoms and represented by the following general formula (1): (CuxMy)(VaPb)Ot. In the general formula (1), M represents a metallic element with an atomic number of 11 or more other than Cu and V, 1.60≤x≤2.40, 0.00≤y≤0.40, 1.60≤a≤2.40, 0.00≤b≤0.40, 5.00≤t≤9.00, 1.60≤x+y≤2.40, and 1.60≤a+b≤2.40.

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Patent Owner(s)

Patent OwnerAddress
NIPPON CHEMICAL INDUSTRIAL CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukazawa, Junya Tokyo, JP 12 12
Hata, Toru Tokyo, JP 14 26
Kato, Takuma Tokyo, JP 26 31

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