PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR COMPONENT AND CORRESPONDING MICROMECHANICAL SENSOR COMPONENT
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United States of America
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Apr 3, 2025
app pub date -
Sep 26, 2024
filing date -
Sep 26, 2024
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Abstract
A production method for a micromechanical sensor component and a corresponding micromechanical sensor component. The production method includes: providing a sensor wafer with a plurality of micromechanical sensor chips, which include one or more relevant sensor regions; forming an access wafer with one or a corresponding plurality of access chips, which in each case include one or more access regions to the sensor regions, which form relevant media access regions for the sensor regions; attaching the access wafer to the sensor wafer, so that the access regions are arranged above the corresponding sensor region(s); and separating the sensor chips with the access chips glued thereon, in order to obtain a plurality of sensor component chips.
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