Importance

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Abstract

A device includes a cap wafer with a sealing region surrounding a gap-control region, and a structure wafer with a corresponding sealing region and gap-control region. The cap wafer has top and bottom surfaces, defining an xy-plane, and a vertical z-direction perpendicular to this plane. The structure wafer is similarly oriented, with its top surface parallel to the xy-plane. The cap wafer and structure wafer are bonded by a eutectic seal connecting their sealing regions, ensuring alignment of their gap-control regions along the z-axis. The device also includes a metal layer located on the bottom surface of the cap wafer in its gap-control region, and the structure wafer features a standoff protruding from its top surface within its gap-control region, extending along the z-direction to contact the metal layer.

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First Claim