Importance

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Abstract

A description is given of a sensor device and a method for producing same. According to one example implementation, the sensor device includes a chip carrier, a semiconductor chip mounted on the chip carrier, and electrical connections between connection pads of the semiconductor chip and corresponding connection pads of the chip carrier. The sensor device further includes a sensor chip arranged on the semiconductor chip and having a sensor element. The sensor chip has trenches that mechanically decouple the sensor element from the rest of the sensor chip. The chip package forms a mold compound that at least partially encapsulates the semiconductor chip and the electrical connections and has an opening in the region of the sensor element so that the sensor element can interact with a medium surrounding the sensor device. The mold compound covers the semiconductor chip except for the sensor chip.

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First Claim