PRESSURE VALVE FOR MICROELECTROMECHANICAL SYSTEM DIE
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Oct 3, 2023
filing date -
Oct 3, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A MEMS die comprises a substrate having an opening, a diaphragm attached to the substrate around a periphery of the opening so as to cover the opening, the diaphragm having an aperture, and a backplate separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate, the backplate comprising a plug that extends toward the aperture from an attached end to a free end. In an embodiment the free end of the plug has a smaller area than the aperture, and the plug is separated from the diaphragm by a gap, wherein a size of the gap determines a level of fluid communication across the diaphragm through the aperture.
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