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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
FORD GLOBAL TECHNOLOGIES LLC	1 AMERICAN RD FL4 DEARBORN MI 48126

International Classification(s)

• B60R:VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT ....
• E05D:HINGES OR OTHER SUSPENSION DEVICES FOR DOORS, WIND....
• E05F:DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSIT....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Courtright, Mark Joseph	Allen Park, US	22	83
# of filed Patents : 22 Total Citations : 83
Diamond, Brendan	Grosse Pointe, US	115	51
# of filed Patents : 115 Total Citations : 51
Falenski, Jason Daniel	Berkley, US	1	0
# of filed Patents : 1 Total Citations : 0
Hilliard, Heath W	Royal Oak, US	16	164
# of filed Patents : 16 Total Citations : 164
Salter, Stuart C	White Lake, US	1041	6210
# of filed Patents : 1041 Total Citations : 6210
Valdez, Omar	Cuautitlan Izcalli, MX	1	0
# of filed Patents : 1 Total Citations : 0

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Oct 3, 2028
7.5 Year Payment	$3600.00	$1800.00	$900.00	Oct 3, 2032
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Oct 3, 2036

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2017/0018,513

SEMICONDUCTOR PACKAGE INCLUDING AN ANTENNA FORMED IN A GROOVE WITHIN A SEALING ELEMENT

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Abstract

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There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.

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Description

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