SYSTEMS AND METHODS FOR CONCURRENT REACTION-BONDED JOINING AND DENSIFICATION

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250108568A1
SERIAL NO

18375331

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Abstract

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A method can include providing two or more parts. The two or more parts can include a first part and a second part. The method can include disposing a source material between the first part and the second part. The method can include joining and densifying the first part and the second part by reacting a liquid with the source material.

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Patent Owner(s)

Patent OwnerAddress
UCHICAGO ARGONNE LLC5801 SOUTH ELLIS AVENUE CHICAGO IL 60637

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Du, Wenchao Willowbrook, US 3 4
Singh, Dileep Naperville, US 36 507

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