POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250108473A1
SERIAL NO

18376282

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Chemical mechanical polishing system and method include a substrate is loaded into a carrier head having a housing having an upper carrier body and a lower carrier body, and a membrane assembly beneath the lower carrier body. A space between the lower carrier body and the membrane assembly defines a pressurizable chamber, a distance from a sensor in the lower carrier body to the membrane assembly is measured, and pressure in the pressurizable chamber is controlled based on the measured distances to maintain a consistent total downforce on the membrane assembly as the distance between the sensor and the membrane assembly changes.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Kuen-Hsiang Sunnyvale, US 6 0
Fernando, Welarumage Ravin Santa Clara, US 2 0
Fujikawa, Takashi San Jose, US 56 1084
Gurusamy, Jay Santa Clara, US 62 82
Lau, Eric Santa Clara, US 42 202
Mikhaylichenko, Ekaterina A San Jose, US 28 4
Nagengast, Andrew J Sunnyvale, US 56 399
Oh, Jeonghoon Saratoga, US 138 872
Zhang, Huanbo San Jose, US 32 76
Zuniga, Steven M Soquel, US 206 2730

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