TREATMENT LIQUID SUPPLYING METHOD AND SUBSTRATE TREATING APPARATUS
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United States of America
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Issued Date -
Apr 3, 2025
app pub date -
Nov 21, 2022
filing date -
Nov 21, 2022
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Abstract
The present invention relates to a treatment liquid supplying method and a substrate treating apparatus. The treatment liquid supplying method for a substrate treating apparatus provided with a nozzle configured to eject a treatment liquid, a pipe connected to the nozzle, an on-off valve provided on the pipe, and a suck back valve provided on the pipe between the nozzle and the on-off valve includes an ejection stopping step of stopping ejection of the treatment liquid from the nozzle by causing the on-off valve to perform closing operation, and a liquid cut-off position adjusting step of adjusting a liquid cut-off position as a position where the treatment liquid in a column shape ejected from the nozzle is cut off by causing the suck back valve to perform first suction operation in association with the closing operation by the on-off valve.
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