SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Dec 6, 2024
filing date -
Dec 6, 2024
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Abstract
A semiconductor device includes a lead frame, a semiconductor element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
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