SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
May 31, 2024
filing date -
May 31, 2024
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Abstract
According to one embodiment, a semiconductor device includes a first electrode, a second electrode separated from the first electrode, and a semiconductor part located between the first electrode and the second electrode. The semiconductor part includes a first region, a second region, and a third region located between the first region and the second region in a second direction perpendicular to a first direction that is from the first electrode toward the second electrode. The third region includes a tenth semiconductor region of the first conductivity type located on the first electrode, and a current blocking region located between the sixth semiconductor region and the ninth semiconductor region in the second direction and located on the tenth semiconductor region.
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