INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 21, 2023
filing date -
Sep 21, 2023
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Abstract
Coaxial magnetic inductor structures useful for semiconductor packaging applications are provided. The coaxial magnetic inductors can be located in semiconductor package cores and the semiconductor package cores can be, for example, comprised of an amorphous solid glass material. Methods of manufacturing a coaxial magnetic inductors in a package substrate core are also provided.
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