POWER MODULE COOLING SYSTEM
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 26, 2023
filing date -
Sep 26, 2023
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Abstract
Embodiments of the present disclosure are directed to power module cooling systems. In particular, some embodiments of the present disclosure relate to power module cooling systems with structures to generate three-dimensional swirling and tumbling in liquid coolant flowing within a chamber of the cooling system. Other embodiments may be disclosed or claimed.
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