SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 25, 2023
filing date -
Sep 25, 2023
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Abstract
A device may include a heat sink body defining a fluid reservoir. A device may include a working fluid in the fluid reservoir. A device may include a movable contact surface configured to transfer heat from a heat-generating component to the working fluid, wherein at least a portion of the movable contact surface is movable relative to the heat sink body.
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